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Mounting and dismantling of electronic components
Professional services for precision mounting, desoldering, and replacement of electronic components of any complexity class. Ensuring restoration of functionality, modernization, and refinement of printed circuit assemblies at various stages of the product life cycle.
Equipment
ERSA IR/PL650A Repair Station
Work Conditions
ESD Standard Compliance
Supported Component Types
THT, SMD, BGA
Spot and Uniform Heating
Soldering and Desoldering Methods
Digital Stabilization Accuracy
±1.5°C
The Engineering Center for Radio-Electronic Instrumentation of the Saint Petersburg Technopark provides services for the mounting and dismantling of electronic components on printed circuit boards using professional high-precision equipment. The technology includes manual and automated dismantling of elements, installation of new components, and modification of boards for altered circuits or structures.
The ERSA IR/PL650A station and PHB-2KA IR system provide controlled heating and dismantling of components, including large elements and through-hole components. NASE-2B and RMSE-2D nanostations allow for work with miniature chips, micro-assemblies, and high-density layouts.
Work is performed by qualified specialists in laboratory conditions with temperature control and compliance with ESD protection. The service is in demand during the development, debugging, repair, and testing stages of modern electronic equipment.
The ERSA IR/PL650A station and PHB-2KA IR system provide controlled heating and dismantling of components, including large elements and through-hole components. NASE-2B and RMSE-2D nanostations allow for work with miniature chips, micro-assemblies, and high-density layouts.
Work is performed by qualified specialists in laboratory conditions with temperature control and compliance with ESD protection. The service is in demand during the development, debugging, repair, and testing stages of modern electronic equipment.
Applications
Repair and Restoration of Board Functionality
Installation and replacement of components in prototypes
Testing and modification of electronic circuits
Preparation of pilot samples for R&D
Workflow stages
Determination of component types, replacement conditions, and board layout features.
Placement in the work area in compliance with ESD requirements and positioning accuracy.
Removal of faulty or temporary elements using controlled heating and temperature monitoring.
Installation of SMD, THT, BGA, and other elements ensuring a strong and clean connection.
Visual and instrumental inspection, checking for short circuits, contact quality, and circuit compliance.
Advantages
Work with high-density boards
Versatility across component types
Micro-soldering without component overheating
Capability for repair and prototyping operations
Case studies
Cost
Service name
Cost
For St. Petersburg SMEs (-20%)
For St. Petersburg UAS R&D Center residents (-30%)
Mounting/dismounting of micro-assemblies on ERSA IR/PL650A repair station without thermal profile selection
Mounting/dismounting of micro-assemblies on ERSA IR/PL650A repair station with thermal profile selection
Dismounting, reballing, and mounting of BGA components on ERSA IR/PL650A without thermal profile selection
Dismounting, reballing, and mounting of BGA components on ERSA IR/PL650A with thermal profile selection
1,100 ₽
1,200 ₽
1,800 ₽
2,100 ₽
880 ₽
960 ₽
1,440 ₽
1,680 ₽
770 ₽
840 ₽
1,260 ₽
1,470 ₽
Order service
Contacts
Irina Kostenko
Director of the Regional Engineering Center for Radio-Electronic Instrumentation of the Saint Petersburg Technopark
i.kostenko@spbtech.ru
+7 (812) 670-10-85 (ext. 309)
Address
30 Zanevsky Ave, Bldg 2
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