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X-ray Inspection
A non-destructive testing method designed to identify hidden defects in the internal structure of objects. It is used for 2D inspection of printed circuit boards, quality control of soldered and welded joints, and research into the internal structure of PCBs. It is applied in R&D, defect analysis, incoming inspection, and acceptance testing.
Equipment
YXLON Cheetah EVO Industrial Computed Tomography System
X-ray penetration depth
up to 10 mm
Scanning resolution
0.5 µm
up to 300×300 mm
Maximum object dimensions
Detector type
flat panel
X-ray inspection is a method of non-destructive testing of the internal structure of products. The technology allows for the detection of defects such as pores, cracks, cold solder joints, and bond integrity failures without mechanical impact on the object.
The equipment provides high-resolution imaging, enabling the inspection of microelectronic components, multilayer printed circuit boards, and complex assemblies. The technique is applied at various stages of the production cycle: from R&D to quality control of serial products.
The equipment provides high-resolution imaging, enabling the inspection of microelectronic components, multilayer printed circuit boards, and complex assemblies. The technique is applied at various stages of the production cycle: from R&D to quality control of serial products.
Aerospace industry
Radio-electronic and microelectronic industry
Power engineering
Instrument engineering
Applications
Workflow stages
Specialists analyze the technical assignment, clarify product characteristics and inspection goals. Optimal research parameters, report format, and deadlines are determined
The product is cleaned of contaminants and placed in the inspection zone in compliance with technical requirements. X-ray equipment is set up, and radiation parameters are calibrated to ensure high research accuracy.
Layer-by-layer scanning of the object is carried out, obtaining a series of X-ray images in 2D inspection mode. Various research modes are used to identify internal defects, cold solder joints, bond breaks, and hidden cracks.
Images are processed using specialized software, and the product structure parameters are analyzed. Expert engineers identify possible defects and compare them with reference samples and regulatory requirements.
Based on the research results, a report is compiled with attached X-ray images, identified defects, and their classification. The document includes recommendations for correcting identified deficiencies or confirms the product's compliance with quality standards.
The final report is delivered to the customer in a convenient format (digital or printed), and a consultation on the inspection results is provided. If necessary, improvements or alternative quality control methods are proposed.
Advantages
Non-destructive testing nature
Capability to inspect complex-profile objects
High resolution
Rapid diagnostics with minimal sample preparation
Case studies
Cost
Service name
Cost
For St. Petersburg SMEs (-20%)
For St. Petersburg UAS R&D Center residents (-30%)
X-ray inspection on YXLON Cheetah EVO (without joint quality analysis, 1 product / 1 inspection point)
X-ray inspection on YXLON Cheetah EVO (with joint quality analysis, 1 product / 1 inspection point)
X-ray inspection on YXLON Cheetah EVO (product laminography / primary, 1 hour)
X-ray inspection on YXLON Cheetah EVO (product laminography, additional cycle, 1 hour)
600 ₽
1,200 ₽
4,300 ₽
3,100 ₽
480 ₽
960 ₽
3,400 ₽
2,480 ₽
420 ₽
840 ₽
3,010 ₽
2,170 ₽
Order service
Contacts
Irina Kostenko
Director of the Regional Engineering Center for Radio-Electronic Instrumentation of the Saint Petersburg Technopark
i.kostenko@spbtech.ru
+7 (812) 670-10-85 (ext. 309)
Address
30 Zanevsky Ave, Bldg 2
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