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Equipment
Nikon BW-S505 optical profilometer
Field of view (single frame)
up to 500×500 μm
Vertical resolution
up to 1 nm
FVWLI (white light)
Measurement principle
Measurement results
3D image + numerical analysis
The full-field white light interferometry method allows for non-destructive testing of surfaces with sub-nanometer precision. The technology is based on the analysis of the interference pattern arising from scanning the surface with coherent radiation.
The equipment provides automated acquisition of topographic maps followed by quantitative data processing. It is possible to perform static and dynamic measurements, including roughness, waviness control and micro-relief parameters.
The Engineering Center for Radio-Electronic Instrumentation of the St. Petersburg Technopark provides surface profile measurement services using the Nikon BW-S505 optical profilometer, operating on FVWLI technology — full-field white light interferometry. The method ensures accurate 3D micro-relief data without contact with the sample and with nanometer vertical resolution.
The service is used for roughness analysis, micro-defect detection, micro-volume depth measurement and finish quality control. It is suitable for both process control and scientific research in microelectronics, materials science, precision mechanics, and other related fields.
Measurements are performed by qualified specialists with interpretation of results upon the customer's request and the potential issuance of a report.
The equipment provides automated acquisition of topographic maps followed by quantitative data processing. It is possible to perform static and dynamic measurements, including roughness, waviness control and micro-relief parameters.
The Engineering Center for Radio-Electronic Instrumentation of the St. Petersburg Technopark provides surface profile measurement services using the Nikon BW-S505 optical profilometer, operating on FVWLI technology — full-field white light interferometry. The method ensures accurate 3D micro-relief data without contact with the sample and with nanometer vertical resolution.
The service is used for roughness analysis, micro-defect detection, micro-volume depth measurement and finish quality control. It is suitable for both process control and scientific research in microelectronics, materials science, precision mechanics, and other related fields.
Measurements are performed by qualified specialists with interpretation of results upon the customer's request and the potential issuance of a report.
Applications
Microelectronics and microwave devices
Precision Mechanics and Mechanical Engineering
Materials Science and Nanotechnology
Research and Development
Workflow stages
Assessment of dimensions, reflectivity, and accuracy requirements. Surface preparation for scanning (if necessary).
Selection of optical scheme, lens configuration, field of view, and interferometry parameters for the customer's task.
Surface scanning with the generation of a 3D height map. Analysis of microrelief, depth, and roughness.
Generation of a color 3D map, numerical report, and graphs for selected parameters: Ra, Rz, depth, pitch, etc.
Issuance of the report, visualizations, and, if necessary, consultation on the interpretation and further application of the data.
Advantages
Nanometer measurement accuracy
Full non-contact 3D imaging
Rapid processing and visualization
Case studies
Cost
Service name
Cost
For St. Petersburg SMEs (-20%)
For St. Petersburg UAS R&D Center residents (-30%)
Surface profile measurement using the BW-S505 optical profilometer
Surface profile measurement using the BW-S505 optical profilometer with 3D model construction
1,150 ₽
1,680 ₽
920 ₽
1,344 ₽
805 ₽
1,176 ₽
Order service
Contacts
Irina Kostenko
Director of the Regional Engineering Center for Radio-Electronic Instrumentation of the Saint Petersburg Technopark
i.kostenko@spbtech.ru
+7 (812) 670-10-85 (ext. 309)
Address
30 Zanevsky Ave, Bldg 2
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