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Equipment
Bondtec 56xx ultrasonic welding system
Welding materials
Al and Au wire
Positioning accuracy
up to 10 µm
Controlled amplitude and force
Welding parameters
Connection type
Flux-free and heat-free
The Engineering Center for Radio-Electronic Instrumentation of the Saint Petersburg Technopark provides ultrasonic wedge-wedge wire bonding services. The process is performed using gold (Au) or aluminum (Al) wire on a high-precision Bondtec 56xx system, developed specifically for microelectronics tasks.
The technique ensures strong and reliable connections with high conductivity and minimal thermal impact on sensitive components. Controllable parameters—amplitude, force, time—are adjusted individually for each product type, ensuring high repeatability and quality control.
The service is applied in the production and prototyping of semiconductor devices, MEMS devices, integrated circuits, and other high-density component assemblies. Both single connections and serial operations as part of a complex assembly can be performed.
The technique ensures strong and reliable connections with high conductivity and minimal thermal impact on sensitive components. Controllable parameters—amplitude, force, time—are adjusted individually for each product type, ensuring high repeatability and quality control.
The service is applied in the production and prototyping of semiconductor devices, MEMS devices, integrated circuits, and other high-density component assemblies. Both single connections and serial operations as part of a complex assembly can be performed.
Applications
Semiconductor crystals and chips
Power electronics and radio modules
MEMS and hybrid micro-assemblies
Connections in R&D and mass production
Workflow stages
Study of component type, material, contact pads, and operating conditions.
Selection of suitable material (Au or Al), setting welding parameters, and position alignment.
Formation of the connection through directed ultrasonic action without flux or heating.
Visual and instrumental control of the strength, accuracy, and integrity of the connection.
Preparation of products for the next stage—encapsulation, assembly, or testing.
Advantages
Reliable electrical contacts
High welding repeatability
Work with sensitive micro-assemblies
Cost
Service name
Cost
For St. Petersburg SMEs (-20%)
For St. Petersburg UAS R&D Center residents (-30%)
Ultrasonic wire bonding of semiconductor structures using the Bondtec 56xx micro-welding system / 1 unit, aluminum
Ultrasonic wire bonding of semiconductor structures using the Bondtec 56xx micro-welding system / 2 units, aluminum
Ultrasonic wire bonding of semiconductor structures using the Bondtec 56xx micro-welding system / 2-5 units
13,500 ₽
15,100 ₽
19,100 ₽
10,800 ₽
12,080 ₽
15,280 ₽
9,450 ₽
10,570 ₽
13,370 ₽
Order service
Contacts
Irina Kostenko
Director of the Regional Engineering Center for Radio-Electronic Instrumentation of the Saint Petersburg Technopark
i.kostenko@spbtech.ru
+7 (812) 670-10-85 (ext. 309)
Address
30 Zanevsky Ave, Bldg 2
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